0%

    14A1R

    Applications: Profile Grinding, Cut Off, Form Grinding, O.D. Grinding, Dicing, Slicing

    Bond Availability: Phenol, Polyimide, Hybrid, Electro-chemical

    Available in: Diamond, CBN, CDX

    Size Availability: 1″ – 27″

    *CDX Bond for Grinding Steel and Tungsten Carbide in combination

    Description